Standardization of a shear test method for lead-free solder paste chip joints-Reference-Cited by-同舟云学术

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Standardization of a shear test method for lead-free solder paste chip joints

Published:2007-05-18 Issue:17 Volume:42 Page:7451-7456
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Choi Jai-Kyoung,Park Jai-Hyun,Ahn Yong-Sik

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-007-1627-5.pdf

Reference9 articles.

1. Korean Agency for Technology and Standards (2003) Sn–Ag–Cu lead-free solder paste, RS D 0026

2. Japanese Standards Association (2003) Test methods for lead-free solders—Part 7. Methods for shear strength of solder joints on chip components, JIS Z 3198-7

3. Kim JW, Yoon JW, Jung SB (2004) Mater Sci Forum 449:897

4. Nadai A (1950) In: Theory of flow and fracture of solids. McGraw–Hill, Inc., New York, p 535

5. Koo JM, Kim DU, Jung SB (2002) IWC—Korea, p 463

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparison of shear strength tests on AV119 epoxy-joined carbon/carbon composites;Composites Part B: Engineering;2010-03

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