Study of Copper Electroplating Films Made by Four Power Modes and Magnetic Field on 20# Steel

Abstract

Copper electroplating films were prepared on 20# steel by four different power modes which are direct current plating, single polar pulse plating, bipolar pulse plating and bipolar pulse plating with magnetic field. The electrochemical performance was investigated in 3.5% NaCl solution by means of potentiodynamic polarization measurement. The morphology and micro structure were characterized by scanning electron microscope and X-ray diffraction. It is proved that the magnetic field is responsible for the improvement of the performance of copper electroplating films.