Advanced copper electroplating for application of electronics
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference12 articles.
1. Damascene copper electroplating for chip interconnections
2. Superconformal Electrodeposition of Copper in 500–90 nm Features
3. Copper Deposition in the Presence of Polyethylene Glycol: I. Quartz Crystal Microbalance Study
4. Leveling and Microstructural Effects of Additives for Copper Electrodeposition
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