Finite Element Modelling of Stress-Induced Fracture in Ti-Si-N Films

Abstract

Nanocomposite coating films have been increasingly used in industrial applications because of their unique mechanical and physical properties. Residual stresses generated during the growth of sputter-deposited thin films due to a strain mismatch between the film and the substrate may lead to significant failure problems. Large residual stresses may generate buckling, delamination and film fracture. Although buckles with cracks in thin films have been experimentally observed, their origins are still not well understood.