Fabrication of Redistribution Layer (RDL) Based on AlN/Sodium Silicate Composite for TSV Interposers

Abstract

3D stacking technology with TSV interconnect is becoming a major trend of microsystem packaging. Redistribution layer (RDL) plays an important role in TSV packaging applications. Inorganic RDL based on AlN/sodium silicate composite through wet process has been put forward in this paper. After mixing AlN powder with sodium silicate uniformly and curing of the mixture, AlN/sodium silicate composite dielectric was formed. Finally a novel wet RDL process was developed for TSV interposer applications.