Numerical Analysis of Constraint and Strength Mismatch Effects on Local Fracture Resistance of Bimetallic Joints

Author:

Fan Kai1,Wang Guo Zhen1,Yang Jie1,Xuan Fu Zhen1,Tu Shan Tung1

Affiliation:

1. East China University of Science and Technology

Abstract

In this paper, the finite element method (FEM) based on GTN model was used to investigate the in-plane/out-of-plane constraint and strength mismatch effects on local fracture resistance of A508/Alloy52Mb bimetallic joint. The J-resistance curves, crack growth paths and local stress-stain distributions in front of crack tips were calculated for cracks with different constraints and strength mismatches. The results show that the local fracture resistance of the interface crack in this joint is sensitive to constraint and strength mismatch effects. With increasing in-plane constraint (crack depth a/W), out-of-plane constraint (specimen thickness B) and strength mismatch degree, the plastic strain and stress triaxiality around crack tip increase, and the corresponding crack growth resistance decreases. The crack with strength mismatch factor M=1 displays a markedly higher crack growth resistance than the other cracks with M>1 and M<1. It also has been found that there is an interaction between in-plane/out-of-plane constraint and strength mismatch for the bimetallic joint. With increasing in-plane/out-of-plane constraint, strength mismatch effect on fracture toughness becomes weaken. For accurate and reliable safety design and failure assessment of the bimetallic joint structures, the effects of constraint and strength mismatch on local fracture resistance need to be considered.

Publisher

Trans Tech Publications, Ltd.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3