Affiliation:
1. Mitsubishi Chemical Corporation Science and Innovation Center
2. Mitsubishi Chemical Corporation Onahama Plant
3. IMEC
Abstract
3 formulated etchants were prepared and their etch rates were measured using blanket wafers in order to confirm that the etching reactions on Si1-XGeX and Si are controllable. Si1-XGeX selective etching with those formulations was also verified using the wafers which had Si1-XGeX and Si multi-stacked structures. Cross-sectional transmission electron microscope (TEM) images suggested that the formulations were usable for Si1-XGeX selective etching processes.
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
Reference10 articles.
1. C. Auth et al., VLSI Tech Dig., (2012) 131-132.
2. A. Jouve et al., J. Vac. Sci. Technol. B 25 (6) (2007) 2504-2507.
3. T. Watanabe et al., ECS Transactions, 58 (6) (2013) 191-196.
4. H.-W. Chen et al., ECS Trans., 2015, 69 (8) (2015) 119-130.
5. H. Mertens et al., IEDM Tech Dig., (2016) 524-527.
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