Affiliation:
1. Xuzhou Institute of Technology
Abstract
Thermal cycling of a unit Sn0.7Cu solder was studied based on the steady-state creep constitutive equation and Matlab software. The results show that there is a steady-state cycle for the thermal cycling of unit Sn0.7Cu eutectic solder. In steady-state thermal cycling, the shear stress is increased with the increase of temperature. There is a stage of stress relaxation during high temperature. A liner relationship between maximum shear stress and maximum shear strain is observed during thermal cycling. The metastable cycle number is declined greatly with the increase of maximum shear strain.
Publisher
Trans Tech Publications, Ltd.