Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles-Reference-Cited by-同舟云学术

Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles

Published:2001-09 Issue:9 Volume:30 Page:1222-1227
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Guo F.,Lee J.,Lucas J. P.,Subramanian K. N.,Bieler T. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0153-5.pdf

Reference42 articles.

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2. J.S. Hwang and Z.F. Guo, Proc Surface Mount Int. Conf., Vol. 2 (Edina, MN: Surface Mount Int., 1993), p. 732.

3. S. Jin, JOM 45, 13 (1993).

4. M. McCormack and S. Jin, JOM 45, 36 (1993).

5. A.W. Gibson, S. Choi, T.R. Bieler, and K.N. Subramanian, IEEE 5th Int. Symp. on Electronics and the Environment (Piscataway, NJ: IEEE, 1997), p. 246.

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