Abstract
It is well-known that the vibration significantly affect the life of solder joint. In this
paper, the effects of the vibration on the failure probability of the solder joint are studied by using
the failure probability models such as the First Order Reliability Method (FORM) and the Second
Order Reliability Method (SORM). The accuracies of the results are estimated by a help of the
Monte Carlo Simulation (MCS). The reliability of the lead and the lead-free solder joint was also
evaluated. The reliability of lead-free solder joint is found to be higher than that of lead solder joint.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference7 articles.
1. C. Basaran, R. Dhandaroy: Mechanics of Pb40/Sn60 neareutectic solder alloy subjected to vibration., Appl Math Model, Vol 22 (1998), pp.601-627.
2. S. Mahadevan and A. Haldar: Reliability Assessment Using Stochastic Finite Element Analysis (John Wiley & Son, 2000).
3. O.S. Lee, S.S. Choi and D.H. Kim: Solid State Phenomena, Vol. 110 (2006), pp.221-230.
4. O.S. Lee and D.H. Kim: Key Engineering Materials, Vol. 326-328 (2006), pp.597-600.
5. O.S. Lee, M.J. Hur, J.S. Hawong, N.H. Myoung and D.H. Kim: Key Engineering Materials, Vol. 326-328 (2006), pp.621-624.
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