Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint-Reference-Cited by-同舟云学术

Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

Published:2008-07 Issue: Volume:385-387 Page:433-436
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Shohji Ikuo¹,Tohei Tomotake¹,Yoshizawa Keisuke¹,Nishimoto Masaharu²,Ogawa Yasushi²,Kawano Takayuki²

Affiliation:

1. Gunma University

2. SOMAR Corporation

Abstract

Accelerated thermal cycling (ATC) tests were conducted to investigate an effect of thermal cycle conditions on thermal fatigue life of a chip size package (CSP) lead-free solder joint. A ternary Sn-Ag-Cu alloy was used as a lead-free solder material. For frequency of thermal cycle (1~3 cycles/h) and maximum (388~423 K) and minimum (223~273 K) temperatures investigated, the effects of them on thermal fatigue life of the solder joint were slight. On the contrary, correlation was recognized between temperature amplitude and thermal fatigue life of the solder joint. The thermal fatigue life increased with decreasing temperature amplitude. The relationship obeyed the Coffin-Manson’s type equation.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.385-387.433.pdf

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