Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process-Reference-Cited by-同舟云学术

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Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process

Published:2007-03 Issue: Volume:334-335 Page:385-388
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Park Yong Tae¹,Kang Tae Min¹

Affiliation:

1. Hynix Semiconductor Inc.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.334-335.385.pdf

Reference8 articles.

1. L. T. Manzione: Plastic Packaging of Microelectronic Devices, New York: Van Nostrand Reinhold (1990), pp.284-287.

2. J. Oda and J. Sakamoto: Finite Elements in Analysis and Design, 30 (1998), pp.147-162.

3. A. Hamzehdoost and L. Yip: Electronic Components and Tech. Conf. 45 th, (1995), pp.229-233.

4. T. S. Dickson and M. F. Matthew: ASME J. Electronic Packaging, 123 (2001), pp.286-272.

5. ANSYS Manual: ANSYS/PDS.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Reaction Shrinkage on Stress in Semiconductor Packages;Journal of Electronic Materials;2009-07-29

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