1. C.Y. Chang and S.M. Sze, ULSI Technology (New York: McGraw-Hill, 1996), p. 555.
2. M. Bartholomew, An Engineer’s Handbook of Encapsulation and Underfill Technology (Port Erin: Electrochemical, 1999), p. 11.
3. C.A. Harper, Electronic Packaging & Interconnection Handbook, 2nd ed. (New York: McGraw-Hill, 1997), pp. 6.14–6.46.
4. JEDEC (Joint Electron Device Engineering Council) Standard No. 22-A104-B.
5. JEDEC (Joint Electron Device Engineering Council) Standard No. 22-A103-C.