Long-Term Stability of Mold Compounds and the Influence on Semiconductor Device Reliability-Reference-Cited by-同舟云学术

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Long-Term Stability of Mold Compounds and the Influence on Semiconductor Device Reliability

Published:2012-03-21 Issue:7 Volume:41 Page:2010-2017
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Mahler Joachim,Mengel Manfred

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-2030-9.pdf

Reference11 articles.

1. AEC (Automotive Electronics Council), www.aecouncil.com and www.onsemi.com/pub_link/Collateral/TND387-D.PDF , p. 13. Accessed 17th June 2011.

2. JEDEC (Joint Electron Device Engineering Council) Standard No. 22-A104-B.

3. M. Mengel and J. Mahler, J. Electron. Mater. 38, 2362 (2009).

4. M. Lebbai, K. Jang-Kyo, and M.M.F. Yeun, J. Electron. Mater. 32, 574 (2003).

5. E. Nguegang, J. Franz, A. Kretschmann, and H.E. Sandmaier, 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2010), p. 28.

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