Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy Films

Abstract

The amorphous Ni-Pd-P alloy films with superior property have good heat conductivity and wear performance. They are widely used in the protecting coating. Copper has been chosen to be a substrate material of the produce of amorphous Ni-Pd-P alloy films with its unique electrical properties. The precision lapping technology for the copper substrate using semi-bonded abrasive grinding plate is studied in this paper. The influences of the different lapping parameters on the surface roughness, material removal rate on copper substrate surface formation in the precision lapping process are both discussed. Experimental results indicate that the copper substrate can be efficiently processed by 800# SiC semi-bonded abrasive grinding plate of, and the initial roughness of a machined surface could be improved from 0.553μm Ra to 0.28μm in 10min, yielding a ideal rarely scratch surface.