Automatic Polishing Technology on Free Surface by Grinding Center

Author:

Wu Xiao Jun1,Sun Shu Dong2,Zheng Chao3

Affiliation:

1. Hebei University of Technology

2. Northwestern Polytechnical University

3. Xi’an University of Architecture and Technology

Abstract

Die and mold are constructed with various free surfaces. In the machining of die and mold, it takes a long time to finish the curved surface. In this study high accurate polishing technique by GC (grinding center) with elastic ball type wheel is developed. In polishing process it is very important to remove cusp height without decreasing machined form accuracy. It is available to use GC in free surface grinding and finishing of die and mold with elastic ball type wheel. In polishing process only cusp height is removed in order to keep form accuracy that is produced in cutting process with ball end mill. In order to know the polishing characteristics of elastic ball type wheel, basic experiments were conducted. The polishing parameters Sp. were obtained experimentally by changing the values of polishing process. Using polishing parameter, removal amount can be obtained and polished surface is possible to estimate.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference14 articles.

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2. Q.F. Deng, J.L. Yuan, D.H. Wang and et al: Approach to Semi-fixed Abrasive Grinding Plate on Surface Lapping Copper Substrates of Amorphous Ni-Pd-P Alloy Films. Surface Technology, Vol. 38 (2009) No. 04, pp.1-3. (In Chinese).

3. L. Zarudi and L. Zhang: Subsurface Damage in Single-Crystal Silicon due to Grinding and Polishing. Journal of Materials Science Letters NETHERLANDS, Vol. 22 (2005) No. 1, pp.117-120.

4. F. Liu, Y.B. Wang, W.C. Zhang, et al: Effect of Polishing Processes on the Roughness of GaAs Wafers. Semiconductor Technology, Vol. 34 (2009) No. 8, pp.745-747. (In Chinese).

5. T.F. Wang, X.L. Zhang and B.G. Shi: Influences of Polishing Parameters on Subsurface Damage of Polishing Components. Aviation Precision Manufacturing Technology, Vol. 44 (2008) No. 1, pp.25-27. (In Chinese).

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