Preparation of Multilayer Barium Titanate PTC Thermistor with Low Room Temperature Resistance

Author:

Zhou Dong Xiang1,Liu Huan1,Gong Shu Ping1,Zhang Dao Li2

Affiliation:

1. Huazhong University of Science and Technology

2. Huazhong Uiversity of Science and Technology

Abstract

Chip-type PTC thermistors with multilayer stacked structure have been fabricated by bonding sintered ceramic chips with internal electrodes to offer low resistance at room temperature and correspondence to surface mounted technology. The resistance-temperature characteristics of multiplayer stacked PTC thermistors made up of different numbers (N = 1, 3, 5) of layers were experimentally investigated (the typical size of each layer was 10 mm × 7.0 mm × 0.38 mm). The selection and extraction of additives in roll-forming process were also discussed. This resulted in a crack-free multiplayer stacked PTC thermistor.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference11 articles.

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5. J.L. Ma and Y. F. Qu: J. Tinajin Institute of Urban Construction Vol. 4.

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