On the Multilayered Chip-Type PTC Elements Prepared by Roll-Forming Process
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Published:2007-04
Issue:
Volume:336-338
Page:661-664
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ISSN:1662-9795
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Container-title:Key Engineering Materials
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language:
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Short-container-title:KEM
Author:
Liu Huan1,
Gong Shu Ping1,
Zhou Dong Xiang1
Affiliation:
1. Huazhong University of Science and Technology
Abstract
We describe the fabrication of chip-type PTC elements (BaTiO3-based) by roll-forming process. Crack-free green tapes with good malleability are successfully obtained with the thickness typically in the range of 0.20~1.0mm. We also focus on reducing the room-temperature resistance of the chip-type PTC element without deteriorating its PTC effect, both by controlling the firing schedule and by introducing multilayer structure with electrode-bonding method. The typical size of the 5-layered chip-type PTC sample obtained is 8.0mm×5.0mm×1.95mm with R25=1.97- and Rmax/Rmin=4.8×105.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
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