Robust Double-Ring Junction Termination Extension Design for High Voltage Power Semiconductor Devices Based on 4H-SiC
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Published:2015-06
Issue:
Volume:821-823
Page:656-659
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Hürner Andreas1, di Benedetto Luigi2, Erlbacher Tobias3ORCID, Mitlehner Heinz3, Bauer Anton J.3, Frey Lothar1
Affiliation:
1. University of Erlangen-Nuremberg 2. University of Salerno 3. Fraunhofer Institute for Integrated Systems and Device Technology
Abstract
In this study, a new robust double-ring junction-termination-extension (DR-JTE) for high-voltage pn-diodes is presented and analyzed using numerical simulations. As figured out, the DR-JTE reduces the electrical field at both, the edge of the single-JTE region and the MESA-transition, respectively. Thereby, due to the reduction of the electrical field, the maximum breakdown voltage is increased to 91.5% of the theoretical, parallel-plane breakdown voltage of 6.5kVand the maximum acceptable deviation of the optimum implantations dose is twice than that of the single-JTE structure. Furthermore, due to the internal ring, the MESA-transition is shielded from the electrical field and therefore the breakdown voltage is much less affected by the angle of the MESA.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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