Ion Implanted Lateral p+-i-n+ Diodes on HPSI 4H-SiC

Author:

Nipoti Roberta1ORCID,Moscatelli Francesco1,Roncaglia Alberto1,Bonafè Filippo1,Mancarella Fulvio1,de Nicola Pietro2,Nath Anindya3,Rao Mulpuri V.3

Affiliation:

1. CNR-IMM

2. Laboratory for Micro and Submicro Enabling Technologies of the Emilia-Romagna Region

3. George Mason University

Abstract

Square shaped annular lateral p+–i–n+ diodes on high purity semi-insulating (HPSI) 4H-SiC are fabricated by Al+ and P+ ion implantation to obtain anode and cathode regions, respectively. All the diodes have the same size central anode surrounded by an intrinsic region, which is surrounded by an annular cathode. Anode area and annular cathode width are fixed for all diodes, only the lateral length of the intrinsic region is varied. Post implantation annealing is performed at 1950 °C for 10 min. Static forward and reverse characteristics are measured in the temperature range of 30 - 290 °C. For all diodes, the reverse current is below the instrument detection limit of 10-14 A up to 100 °C at 200 V, the maximum reverse bias employed in this study. The reverse current increased up to low 108 A for 200 V reverse bias at 290 °C. Forward currents overlap at the low voltage region once they exceed the instrument detection limit at ~1.6 V and 30 °C. The forward currents follow almost identical exponential trend at all measured temperatures while the diode series resistance increase with increasing anode-cathode distance and decreased with increasing temperature for the given intrinsic region lateral length.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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