Improvement on 150 mm 4H-SiC Epitaxial Wafer Quality
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Published:2016-05
Issue:
Volume:858
Page:201-204
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Masuda Tatsuya1,
Miyasaka Akira1,
Norimatsu Jun1,
Tajima Yutaka1,
Muto Daisuke1,
Momose Kenji1,
Osawa Hitoshi
Abstract
For the popularization of SiC power device, improvement on both productivity and quality of 150 mm diameter SiC epitaxial wafer is inevitable. With highly productive 8x150-mm CVD reactor, we have grown epitaxial layer on 4° off 4H-SiC wafer Si-and C-face. Modifying some reactor parts and optimizing growth conditions enabled us to achieve a good balance between high uniformity and smooth surface.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
1 articles.
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