Analysis of Temperature and Thermal Stress Distribution on KDP Crystal Wire Saw Slicing

Abstract

Temperature variation of KDP crystal is an important reason for its cracking. A finite element model was constructed to analyze temperature and thermal stress distribution of KDP crystal during wire saw slicing. The results showed that the highest temperature of the crystal which was located on the sawing kerf remained stable during slicing. The temperature inside the crystal rose slowly at the start of the slicing, and then tended steady with the continued increase of sawing depth. Because of the good cooling condition during the sawing process, the overall rise in temperature was small, and the maximum thermal stress on the sawing kerf was less than the tensile strength of KDP crystal, so temperature variation during slicing had little effect on crystal cracking.