Wafer-Level Hall Measurement on SiC MOSFET

Author:

Yu Liang Chun1,Cheung Kin P.1,Tilak Vinayak2,Dunne Greg3,Matocha Kevin2,Campbell Jason P.1,Suehle John S.1,Sheng Kuang4

Affiliation:

1. National Institute of Standards and Technology

2. General Electric Global Research

3. General Electric Global Research Center

4. Rutgers University

Abstract

Low channel mobility is one of the biggest challenges to commercializing SiC MOSFETs. Accurate mobility measurement is essential for understanding the mechanisms that lead to low mobility. The most widely used effective mobility measurements overestimate the inversion charge for devices that have high level of defects. Mobility measured by the Hall effect is more accurate; however the conventional Hall mobility measurement is tedious. In this work, we demonstrate a wafer-level Hall measurement technique, which is simple and convenient to implement. With this method, extensive study of the mobility degradation is possible.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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