1. V.K. Kapur and U.V. Choudary, Recovery method of wafer cutting slurry: U.S. Patent 4, 388, 286. (1983).
2. D.M. Xu, W.L. Tian and Y.D. Hu, et al. A method of obtained white carbon black and recovery of SiC from wire cutting waste slurry: C.N. Patent 101, 691, 217A. (2010).
3. J. Chen and Y.L. Wang, Chemical recovery method of wire cutting waste slurry: C.N. Patent 101, 623, 898A. (2010).
4. X.F. Xi and H. Song, Recovery method of SiC and PEG in waste slurry: C.N. Patent 101, 474, 511A. (2009).
5. D.P. Yang and K. Zhou, Recovery method of waste slurry of wire cutting: C.N. Patent 101, 513, 753A. (2009).