Separation of Silicon Carbide and Silicon in Silicon Wafer Cutting Waste by means of Liquid-Liquid Extraction Method for Recovery-Reference-Cited by-同舟云学术

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Separation of Silicon Carbide and Silicon in Silicon Wafer Cutting Waste by means of Liquid-Liquid Extraction Method for Recovery

Published:2020 Issue:1 Volume:67 Page:13-21
ISSN:1348-6012
Container-title:Resources Processing
language:en
Short-container-title:RESOURCES PROCESSING

Author:

WANG Li Pang¹,LI Ming Yen¹,JIAN Ting Yi¹,CHEN Yan Jhang¹,CHEN Xue Yi¹

Affiliation:

1. Institute of Environmental Engineering and Management, National Taipei University of Technology

Publisher

The Resources Processing Society of Japan

Subject

Nature and Landscape Conservation,Pollution,Soil Science,Environmental Chemistry

Link

https://www.jstage.jst.go.jp/article/rpsj/67/1/67_13/_pdf

Reference33 articles.

1. 1. T. Surek: J. Cryst. Growth, 275, pp. 292–304 (2005)

2. 2. T.Y. Wang, Y.C. Lin, C.Y. Tai, R. Sivakumar, D.K. Rai, C.W. Lan: J. Cryst. Growth, 310, pp. 3403–3406 (2008)

3. 3. D.G. Li, P.F. Xing, Y.X. Zhuang, F. Li, G.F. Tu: Trans. Nonferrous Met. Soc. China, 24, pp. 1237–1241 (2014)

4. 4. H.Y. Wang, Y. Tan, J.Y. Li, Y.Q. Li, W. Dong: Sep. Purif. Technol., 89, pp. 91–93 (2012)

5. 5. J. Li, K. Huang, H. Zhu: Chem. Eng. Sci., 127, pp. 25–30 (2015)

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