Accuracy Correction of the Measuring Method for Film Stress Gradient Based on Curvature Radius-Reference-Cited by-同舟云学术

Accuracy Correction of the Measuring Method for Film Stress Gradient Based on Curvature Radius

Published:2012-02 Issue: Volume:503 Page:381-385
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Rong Hua¹,Yu Chang Ling¹

Affiliation:

1. Nanjing Normal University

Abstract

Stress gradient of a thin film along its thickness direction has important influence on performance of MEMS/NEMS devices. The measuring method based on curvature radius is a usual method for extracting film stress gradient. In this paper the error of the method has been analyzed using Finite Element Analysis software Coventorware, and the current theory has been modified according to FEA results to enhance its accuracy. Simulating results indicated that the accuracy of the method has been increased observably after correcting.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.503.381.pdf

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