The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder-Reference-Cited by-同舟云学术

The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder

Published:2020-09 Issue: Volume:1010 Page:104-108
ISSN:1662-9752
Container-title:Materials Science Forum
language:
Short-container-title:MSF

Author:

Wong Wei Yee¹,Shamsudin Rabiatul Adawiyah¹,Mohd Nazeri Muhammad Firdaus²,Masri Mohamad Najmi¹

Affiliation:

1. Universiti Malaysia Kelantan

2. Universiti Malaysia Perlis

Abstract

Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffraction (XRD). SEM result shows microstructure Cu6Sn5 is precipitated with rod like shape while CuZn is shown in bump oval shape whereas compounds that presented are Cu6Sn5 and Cu5Zn8 as shown in the XRD analysis result.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.scientific.net/MSF.1010.104.pdf

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