Dislocations Analysis on Implanted (p-Type and n-Type) 4H-SiC Epi-Layer by KOH Molten Etching

Abstract

In this work the effect of the ion implantation on the dislocations structure of the 4H-SiC epilayer after the KOH etching has been investigated. The study was conducted using both Aluminum (Al) and Phosphorous (P) species for p-type and n-type, respectively. The ion implantations of Al and P were carried out at different energies (30–200 keV) to achieve 300 nm thick acceptor box profiles with a concentration of about 1020 at/cm3. The implanted samples were annealed at high temperatures. With sequential sacrificial and stopping layer both species has been implanted on the same sample. Morphological charaterization of the samples (optical microscope and SEM) shown different structural modification of the dislocations (experically TED) after the KOH etching of the samples.