1200 V 4H-SiC DMOSFET with an Integrated Gate Buffer

Author:

Ryu Sei Hyung1,Jonas Charlotte1,Capell Craig1,Lemma Yemane1,Agarwal Anant2,McNutt Ty3,Grider Dave1,Allen Scott T.4,Palmour John W.1

Affiliation:

1. Cree Incorporation

2. EERE

3. APEI Inc.

4. Cree Inc.

Abstract

For the first time, a 1200 V 4H-SiC power MOSFET with a monolithically integrated gate buffer circuit has been demonstrated successfully. The device used a 6x1015cm-3doped, 10 μm thick n-type drift layer to support 1200 V. The gate buffer circuit was built in a p-well, formed by boron ion implantation. The integrated device provided sufficient voltage isolation for the control circuit from the drain of the power MOSFET, and supported internal supply voltages up to 20 V. The operation of the integrated devices was demonstrated. A specific on-resistance (Ron,sp) of 20 mΩ-cm2was observed. The highRon,spwas due to the limitations in NMOS pull-up circuit topology and the body effect in the 4H-SiC NMOSFET. Development of PMOS pull-up devices is recommended for future integration efforts.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference6 articles.

1. http: /www. cree. com/power/products.

2. R. J. Callanan et al., IEEE Industrial Electronics 34th Annual Conference – IECON 2008, pp.2885-2890, Nov. (2008).

3. P. Friedrichs and R. Bayerer, Matarials Science Forum Vols. 740-742 (2013), pp.869-872, Trans Tech Publications, Switzerland.

4. J. Hornberger et al., Electrical Energy Storage Applications and Technologies (EESAT), San Diego, CA, Oct 16-19, (2011).

5. M. N. Ericson et al., to be published in IEEE Transactions on Power Electronics.

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