Microstructure and Properties of Tungsten Copper Composite Material

Abstract

The copper-tungsten system in the liquid and solid phase is completely immiscible. In this paper, the powder solid-phase sintering method was used to prepare the copper-tungsten composites of different compositions (CuxWy, x=63, 78, 84, 87, 90, 91, y=37, 22, 16, 13, 10, 9 (x+y=100)). By XRD and SEM analysis of the sample microstructure, the trend of the ratio of the conductivity, density and hardness of the samples with different ratio were determined. The results show that with the increasing tungsten content, the conductivity of the copper-tungsten composite increases, whereas the amplitude reduces. The actual density of the sample is smaller than its theoretical density. The more the tungsten content is, the smaller its hardness value.