Electrical breakdown characteristic of nanostructured W−Cu contacts materials

Author:

Junbo Wang,Wen'ge Chen,Binjun Ding

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Reference11 articles.

1. L J Kecskes, M D Trexler, B R Klotz,et al. Densification and Structural Change of Mechanically Alloyed W−Cu Composites [J].Metallurgical and Materials Transactions A, 2001, 32A(11):2885–2893

2. B Thomas, K V Walter, M Roland, K E Sacegr. On the Application of W/Cu Materials in the Fields of Power Engineering and Plasma Technology[J].IEEE Transactions, 1991, 14(1):8–13

3. C S Xiong, Y H Xiong, H Zhu, T F Sun,et al. Synthesis and Structural Studies of the Cu−W Alloys Prepared by Mechanical Alloying[J].Nanostructured Materials, 1995, 5(5):425

4. J C Kim, S S Ryu, Y D Kim and I H Moon Densification Behavior of Mechanically Alloyed W−Cu Composite Powders by the Double Rearrangement Process[J].Scripta Materialia, 1998, 39(6):669

5. Jin-Chun Kim, Sung-Soo Ryu and In-Hyung Moon. Nanostructural Characteristics and Sintering Behavior of W−Cu Composite Powder Prepared by Mechanical Alloying[J].Journal of Advanced Materials, 1999, 31(4):37–44

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