Wafer Extension for Cost-Effective Front to Back Side Alignment

Abstract

This work presents a cost-effective and simple possibility to outperform the potential of a standard single side mask aligner. The limited functionality is extended to the capability of back side alignment with minimal effort without additional knowledge and integration of new process technologies. The whole presented process flow performs without the necessity of additional equipment as infrared back side wafer alignment kits or additional etching processes or clamps and brackets. The result is a front to back side alignment process with satisfactory deviation.