Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review-Reference-Cited by-同舟云学术

Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

Published:2009-01 Issue: Volume:404 Page:23-31
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Cong Wei Long¹,Zhang Peng Fei¹,Pei Zhi Jian¹

Affiliation:

1. Kansas State University

Abstract

Lapping is an important material-removal process for manufacturing of substrate wafers. Objectives of lapping include removing subsurface damage in sliced wafers, thinning wafers to target thickness, and achieving a high degree of parallelism and flatness of wafer surfaces. This paper reviews the literature on lapping of substrate wafers. It presents reported experimental results on effects of input parameters (lapping pressure, plate rotation speed, abrasive grain size, slurry concentration, and slurry flow rate) on material removal rate and surface roughness.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.404.23.pdf

Reference16 articles.

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