Grinding, Edge Grinding, Etching, and Surface Cleaning-Reference-Cited by-同舟云学术

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Grinding, Edge Grinding, Etching, and Surface Cleaning

Published:2021-01-09 Issue: Volume: Page:223-246
ISSN:
Container-title:Wafer Manufacturing
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Author:

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781118696224.ch9

Reference73 articles.

1. AsanoM ChoTandMuraokaH1976Abstract 453The Electrochemical Society Extended Abstract vol.76‐2 p. 911 Las Vegas NV.

2. Axus Technology2013Wafer edge grinding process (wafer edge profiling) application note. Technical report Axus Technology.

3. Methods for Surface Particle Removal: A Comparative Study

4. BrandtG1987Method for machining workpieces of brittle hard material into wafers. Technical report GMN Georg Mueller Nuernberg AG. US Patent 4 663 890.

5. Wafer cleaning: Brushes and high‐pressure scrubbers;Burggraaf PS;Semiconductor International,1981

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1. Application of ozone for surface cleaning;Advances and Technology Development in Greenhouse Gases: Emission, Capture and Conversion;2024

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