Interfacial Bonding in a Nanoclay/Polymer Composite-Reference-Cited by-同舟云学术

Interfacial Bonding in a Nanoclay/Polymer Composite

Published:2011-11 Issue: Volume:410 Page:156-159
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Chan Mo Lin¹,Lau Kin Tak¹,Wong Tsun Tat¹

Affiliation:

1. Hong Kong Polytechnic University

Abstract

In this study, X-ray photoelectron spectroscopy (XPS) was conducted to analyze the chemical composition between epoxy matrix and nanocomposite. This experiment revealed that a chemical bonding at an interface between the matrix and nanoclay of the composites did exist. Thus, such bonding can enhance the mechanical and thermal properties of resultant polymer composites as reported in many literatures.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.410.156.pdf

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