Study on Groove Shape of CMP Polishing Pad: A Review-Reference-Cited by-同舟云学术

Study on Groove Shape of CMP Polishing Pad: A Review

Published:2012-04 Issue: Volume:497 Page:278-283
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Lou Chun Lan¹,Di Hai Yan²,Fang Qiang¹,Kong Tao³,Yao Wei Feng³,Zhou Zhao Zhong²

Affiliation:

1. Wanxiang Silicon-Peak Electronics Co.,Ltd

2. Quzhou University

3. Zhejiang University of Technology

Abstract

In the chemical mechanical polishing process (CMP) ，the groove shape of polishing pad is one of the most critical elements that directly influences the quality and efficiency of CMP. This review paper describes the basic patterns of groove shape and that the patterns shape of polishing pad how to effect on quality and efficiency of CMP. The effect comparison between various sorts of groove shape and their effects on polishing is described. It is intended to help reader to gain a more comprehensive view on groove shape of polishing pad, and to be instrumental for research and development new groove shape of polishing pad for CMP.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.497.278.pdf

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5. B. Liu: Study on the Effects of the Surface Texture and Constituent of the Pad in CMP [D]. Da Lian: Da Lian university of technology(2006).

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