Si-based system-in-package design with broadband interconnection for E-band applications-Reference-Cited by-同舟云学术

Si-based system-in-package design with broadband interconnection for E-band applications

Published:2021-04-25 Issue:8 Volume:18 Page:20210140-20210140
ISSN:1349-2543
Container-title:IEICE Electronics Express
language:en
Short-container-title:IEICE Electron. Express

Author:

Chu Jiao¹²,Li Jun¹³,Zhou Yunyan¹³,Cao Jia⁴,Chen Pengwei⁴,Cao Liqiang¹³

Affiliation:

1. System Packaging and Integration Technology Center, Institute of Microelectronics of the Chinese Academy of Sciences

2. School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences

3. National Center for Advanced Packaging

4. Beijing Institute of Radio Measurement

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://www.jstage.jst.go.jp/article/elex/18/8/18_18.20210140/_pdf

Reference34 articles.

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2. [2] X. Xu, et al.: “Plate-laminated waveguide monopulse slot array antenna with full-corporate-feed in the E-band,” IEICE Trans. Commun. E100-B (2017) 575 (DOI: 10.1587/transcom.2016EBP3271).

3. [3] V. Miraftab, et al.: “A wideband low cost E-band SIW antenna array for high capacity mmWave radio,” 2015 IEEE MTT-S International Microwave Symposium (2015) 1 (DOI: 10.1109/MWSYM.2015.7167055).

4. [4] S.S.M. Chung, et al.: “Preliminary design of 94 GHz E-band phase array antenna for future mobile communication,” 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) (2016) 899 (DOI: 10.1109/APEMC.2016.7522903).

5. [5] A. Bessemoulin, et al.: “Soldered hot-via E-band and W-band power amplifier MMICs for millimeter-wave chip scale packaging,” 2016 IEEE MTT-S International Microwave Symposium (IMS) (2016) 1 (DOI: 10.1109/MWSYM.2016.7540025).

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