Analysis of De-Embedding Error Cancellation in Cascade Circuit Design
Author:
Affiliation:
1. Graduate School of Advanced Sciences of Matter, Hiroshima University
2. Graduate School of Engineering, The University of Tokyo
3. Semiconductor & Storage Company, Toshiba Corp.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://www.jstage.jst.go.jp/article/transele/E94.C/10/E94.C_10_1641/_pdf
Reference14 articles.
1. [1] M.C.A.M. Koolen, J.A.M. Geelen, and M.P.J.G. Versleijen, “An improved de-embedding technique for on-wafer high-frequency characterization,” Proc. Bipolar Circuits and Technol. Meeting, pp.188-191, Jan. 1991.
2. A three-step method for the de-embedding of high-frequency S-parameter measurements
3. [3] Y. Tretiakov, K. Vaed, D. Ahlgren, J. Rascoe, S. Venkatadri, and W. Woods, “On-wafer de-embedding techniques for SiGe/BiCMOS/RFCMOS transmission line interconnect characterization,” Proc. Int. Intercon. Tech. Conf., pp.166-168, June 2004.
4. [4] Y. Goto, Y. Natsukari, and M. Fujishima, “New on-chip de-embedding for accurate evaluation of symmetric devices,” Jpn. J. Appl. Phys., vol.47, no.4, pp.2812-2816, 2008.
5. [5] E.S. Daniel, N.E. Harff, V. Sokolov, S.M. Schreiber, and B.K. Gilbert, “Network analyzer measurement de-embedding utilizing a distributed transmission matrix bisection of a single THRU structure,” 63rd ARFTG Conf., pp.61-68, June 2004.
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