A new on-wafer de-embedding technique for on-chip rf transmission line interconnect characterization
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/9529/30199/01387857.pdf?arnumber=1387857
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electro-Absorption Modulator Vertically Integrated on a VCSEL: Microstrip-Based High-Speed Electrical Injection on Top of a BCB Layer;Journal of Lightwave Technology;2019-08-01
2. Broadband Complementary Metal-Oxide Semiconductor Interconnection Transmission Line Measurements With Generalized Probe Transition Characterization and Verification of Multiline Thru-Reflect-Line Calibration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-09
3. Passive Circuit Technologies for mm-Wave Wireless Systems on Silicon;IEEE Transactions on Circuits and Systems I: Regular Papers;2012-08
4. Analysis of De-Embedding Error Cancellation in Cascade Circuit Design;IEICE Transactions on Electronics;2011
5. Silicon Filled Integrated Waveguides;IEEE Microwave and Wireless Components Letters;2010-10
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