Athermal Wavelength Filters toward Optical Interconnection to LSIs
Author:
Affiliation:
1. Tokyo Institute of Technology
2. Quantum Nanoelectronics Research Center (QNERC)
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://www.jstage.jst.go.jp/article/transele/E95.C/2/E95.C_2_229/_pdf
Reference26 articles.
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3. Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections
4. Wafer-level 3D integration technology
5. [5] J. Fujikata, J. Ushida, Y. Ming-Bin, Z.S. Yang, D. Liang, P.L. Guo-Qiang, D. Kwong, and T. Nakamura, “25GHz operation of silicon optical modulator with projection MOS structure,” Proc. Opt. Fiber Commun., no.OMI3, pp.1-3, San Diego, CA, March 2010.
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