An FSK Inductive-Coupling Transceiver Using 60mV 0.64fJ/bit 0.0016mm<sup>2</sup> Load-Modulated Transmitter and LC-Oscillator-Based Receiver in 65nm CMOS for Energy-Budget-Unbalanced Application-Reference-Cited by-同舟云学术

An FSK Inductive-Coupling Transceiver Using 60mV 0.64fJ/bit 0.0016mm² Load-Modulated Transmitter and LC-Oscillator-Based Receiver in 65nm CMOS for Energy-Budget-Unbalanced Application

Published:2019-07-01 Issue:7 Volume:E102.C Page:585-589
ISSN:0916-8524
Container-title:IEICE Transactions on Electronics
language:en
Short-container-title:IEICE Trans. Electron.

Author:

HAYASHI Kenya¹,ARATA Shigeki¹,XU Ge¹,MURAKAMI Shunya¹,BUI Cong Dang¹,KOBAYASHI Atsuki¹,NIITSU Kiichi¹²

Affiliation:

1. Graduate School of Engineering, Nagoya University

2. JST

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.jstage.jst.go.jp/article/transele/E102.C/7/E102.C_2018CTS0002/_pdf

Reference10 articles.

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3. [3] N. Miura, D. Mizoguchi, T. Sakurai, and T. Kuroda, “Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect,” IEEE J. Solid-State Circuits, vol.40, no.4, pp.829-837, April 2005. 10.1109/jssc.2005.845560

4. [4] W. Li, Y. Duan, and J.M. Rabaey, “A 200Mb/s inductively coupled wireless transcranial transceiver achieving 5e-11 BER and 1.5pJ/b transmit energy efficiency,” IEEE Int. Solid-State Circuits Conf. Dig. Tech., pp.290-291, Feb. 2018. 10.1109/isscc.2018.8310298

5. [5] K. Niitsu, S. Kawai, N. Miura, H. Ishikuro, and T. Kuroda, “A 65fJ/b inter-chip inductive-coupling data transceivers using charge-recycling technique for low-power inter-chip communication in 3D system integration,” IEEE Trans. Very Large Scale Integration (VLSI) Systems, vol.20, no.7, pp.1285-1294, July 2012. 10.1109/tvlsi.2011.2150252

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