PdYb-Silicide with Low Schottky Barrier Height to n-Si Formed from Pd/Yb/Si(100) Stacked Structures
Author:
Affiliation:
1. Tokyo Institute of Technology
2. TANAKA Kikinzoku Kogyo Co., Ltd.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/transele/E100.C/5/E100.C_458/_pdf
Reference35 articles.
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2. [2] S. Ohmi, “Importance of Si surface flatness to realize high-performance Si devices utilizing ultrathin films with new material system,” IEICE Electron. Express, vol.11, no.14, p.20142006, 2014.
3. [3] T. Futase, T. Kamino, Y. Inaba, and H. Tanimoto, “Uniform, Low-Resistive Ni-Pt Silicide Fabricated by Partial Conversion with Low Metal-Consumption Ratio,” IEEE Trans. Semicond. Manuf., vol.24, no.4, pp.545-551, 2011.
4. [4] T. Isogai, H. Tanaka, A. Teramoto, T. Goto, S. Sugawa, and T. Ohmi, “Advanced Method for Measuring Ultra-Low Contact Resistivity Between Silicide and Silicon Based on Cross Bridge Kelvin Resistor,” 2009 IEEE ICMTS Conf. Proc., pp.109-113, 2009.
5. [5] G. Larrieu, D.A. Yarekha, E. Dubois, N. Breil, and O. Faynot, “Arsenic-Segregated Rare-Earth Silicide Junctions: Reduction of Schottky Barrier and Integration in Metallic n-MOSFETs on SOI,” IEEE Electron Device Lett., vol.30, no.12, pp.1266-1268, 2009.
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Etching Control of HfN Encapsulating Layer for PtHf-Silicide Formation with Dopant Segregation Process;IEICE Transactions on Electronics;2019-06-01
2. PdEr-Silicide Formation and Contact Resistivity Reduction to n-Si(100) Realized by Dopant Segregation Process;IEICE Transactions on Electronics;2018-05-01
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