Layout-Aware Variability Characterization of CMOS Current Sources

Author:

LIU Bo1,YANG Bo1,NAKATAKE Shigetoshi1

Affiliation:

1. University of Kitakyushu

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. [1] H. Masuda, S. Ohkawa, A. Kurokawa, and M. Aoki, “Challenge: Variability characterization and modeling for 65- to 90-nm process,” Proc. IEEE, Custom Integrated Circuits Conference, 2005, pp.593-599, 2005.

2. [2] M. Yamamoto, H. Endo, and H. Masuda, “Development of a large-scale TEG for evaluation and analysis of yield and variation,” Proc. ICMTS, pp.53-58, 2003.

3. Analysis and Characterization of Device Variations in an LSI Chip Using an Integrated Device Matrix Array

4. [4] X. Qi, A. Gyure, Y. Luo, S.C. Lo, M. Shahram, and K. Singhal, “Measurement and characterization of pattern dependent process variations of interconnect resistance, capacitance and inductance in nanometer technologies,” Proc. 16th ACM Great Lakes symposium on VLSI, pp.14-18, 2006.

5. [5] P.M. O'Neill, P. George, and H. Aoki, “A complete CMOS SPICE model generation system,” 1995 HP Design Technology Conf. Proc., pp.79-86, 1995.

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