Si-based Ka-band SIW band-pass filter using wafer level manufacturing process

Author:

Zhu Hanxiang12,Li Jun13,Cao Liqiang13,Cao Jia4,Chen Pengwei4

Affiliation:

1. System Packaging and Integration Technology Center, Institute of Microelectronics of the Chinese Academy of Sciences

2. School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences

3. National Center for Advanced Packaging

4. Beijing Institute of Radio Measurement

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference30 articles.

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2. [2] P. Vamvakas, et al.: “On controlling spectrum fragility via resource pricing in 5G wireless networks,” IEEE Netw. Lett. 1 (2019) 111 (DOI: 10.1109/LNET.2019.2921425).

3. [3] M. Koivisto, et al.: “Joint device positioning and clock synchronization in 5G ultra-dense networks,” IEEE Trans. Wireless Commun. 16 (2017) 2866 (DOI: 10.1109/TWC.2017.2669963).

4. [4] D. Liu, et al.: “Antenna-in-package design considerations for Ka-band 5G communication applications,” IEEE Trans. Antennas Propag. 65 (2017) 6372 (DOI: 10.1109/TAP.2017.2722873).

5. [5] D. He, et al.: “Channel measurement, simulation, and analysis for high-speed railway communications in 5G millimeter-wave band,” IEEE Trans. Intell. Transp. Syst. 19 (2018) 3144 (DOI: 10.1109/TITS.2017.2771559).

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1. 3-D Printed W-band Substrate Integrated Waveguide Filter Using a Dam-and-Fill Process;2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI);2022-07-10

2. X-band Passive Circuits Using 3-D Printed Hollow Substrate Integrated Waveguides;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Design of High Performance SIW Filter in Millimeter Wave Band;2021 7th International Conference on Computer and Communications (ICCC);2021-12-10

4. Design of a Ka-band receiver front end using Si-based system in package;IEICE Electronics Express;2021-04-25

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