Millimeter-wave transmission line with through-silicon via for RF-MEMS devices

Author:

Ogawa Shinpei1,Yuasa Takeshi2,Fujii Yoshio1,Tahara Yukihiro2,Fukumoto Hiroshi1

Affiliation:

1. Advanced Technology R&D Center, Mitsubishi Electric Co.

2. Information Technology R&D Center, Mitsubishi Electric Co.

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. [1] S. Lucyszyn: Advanced RF MEMS (Cambridge University Press, Cambridge, 2010).

2. [2] G. M. Rebeiz: RF MEMS: Theory, Design, and Technology (John Wiley & Sons, Hoboken, New Jersey, 2003).

3. [3] J. Schoebel, T. Buck, M. Reimann, M. Ulm, M. Schneider, A. Jourdain, G. J. Carchon and H. A. C. Tilmans: IEEE Trans. Microw. Theory Tech. 53 [6] (2005) 1968.

4. [4] S. Ogawa, S. Soda, S.-S. Lee, S. Izuo and Y. Yoshida: Sensors and Actuators A: Physical 181 (2012) 77.

5. [5] Y. Yoshida, Y. Koga, A. Yamashita, K. Nishizawa, Y. Yokoyama, Y. Fujii, T. Hamaguchi, T. Nishino, M. Taguchi and M. Takeda: MEMS (2006) 874.

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