Affiliation:
1. Department of Information Systems Engineering, Osaka University
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Applied Mathematics,Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Signal Processing
Reference31 articles.
1. [1] J.R. Black, “Electromigration — A brief survey and some recent results,” IEEE Trans. Electron Devices, vol.ED-16, no.4, pp.338-347, April 1969.
2. [2] K. Banerjee, M. Pedram, and A.H. Ajami, “Analysis and optimization of thermal issues in high-performance VLSI,” Proc. ISPD, pp.230-237, 2001.
3. Temperature-aware computer systems: opportunities and challenges
4. [4] Y.K. Cheng, C.H. Tsai, C.C. Teng, and S.M. Kang, Electrothermal Analysis of VLSI Systems, Kluwer Academic Publishers, 2000.
5. Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects