Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity
Publisher
Science Publishing Group
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Research on board-level thermal dissipation of the mini LED in COB packaging;International Conference on Optoelectronic Information and Functional Materials (OIFM 2023);2023-08-07
2. Preparation of PCB Substrate Embedded with Ceramic Circuit Board and its Application for LED Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10