Research on board-level thermal dissipation of the mini LED in COB packaging-Reference-Cited by-同舟云学术

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Research on board-level thermal dissipation of the mini LED in COB packaging

Published:2023-08-07 Issue: Volume: Page:
ISSN:
Container-title:International Conference on Optoelectronic Information and Functional Materials (OIFM 2023)
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Author:

Wang Wenli,Xiang Yu

Publisher

SPIE

Reference9 articles.

1. Introduction to requirements of the Printed Circuit Board for small LED;Xiang;Printed Circuit Information,2020

2. Mini LED board with flip-chip COB package and black prepreg;Cheng;Printed Circuit Information,2020

3. Ceramic substrate for electronic packaging;Cheng;Advanced Ceramics,2019

4. Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity

5. Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

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