Modulating residual stress based on atomic layer deposition to enhance the adhesion of parylene C for encapsulation of flexible organic light-emitting diodes

Abstract

Abstract This paper proposes a method for enhancing the adhesion strength between parylene C and the substrate by depositing a layer of Al2O3 film with residual tensile stress on parylene C by atomic layer deposition. Compared with pretreatment using a coupling agent, it improves the adhesion strength by 2.4 times. The parylene C/Al2O3 hybrid film maintains a good barrier performance after 10 000 times of bending with a bending radius of 3 mm, with the water vapor transmission rate (WVTR) retained at 3.55 × 10−4 g·m−2·d−1. Encapsulation of flexible organic light-emitting diodes is carried out using this hybrid film without a negative effect on the performance.