Modeling the Failure of Electronic Devices by Dendrite Growth in Bulk and Thin Layer Electrolytes-Reference-Cited by-同舟云学术

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Modeling the Failure of Electronic Devices by Dendrite Growth in Bulk and Thin Layer Electrolytes

Published:1988-09 Issue:9 Volume:44 Page:644-651
ISSN:0010-9312
Container-title:CORROSION
language:en
Short-container-title:CORROSION

Author:

Meilink S. L.,Zamanzadeh M.,Warren G. W.,Wynblatt P.

Publisher

NACE International

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Link

http://corrosionjournal.org/doi/pdf/10.5006/1.3584978

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrochemical migration of Sn and Sn solder alloys: a review;RSC Advances;2017

2. Effects of direct current electric field on corrosion behaviour of copper, Cl− ion migration behaviour and dendrites growth under thin electrolyte layer;Transactions of Nonferrous Metals Society of China;2014-01

3. Electrochemical migration of tin in electronics and microstructure of the dendrites;Corrosion Science;2011-05

4. Electrochemistry on microcircuits. II: Copper dendrites in oxalic acid;Microelectronic Engineering;2008-08

5. Growth of electrolytic copper dendrites. II: Oxalic acid medium;Journal of Electroanalytical Chemistry;2007-08

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